Lingaliro la High Melting Point Polyamide Hot Melt Adhesive

High-zomatira zosungunuka-zotentha za polyamide-zomatira zosungunula ndizotentha-zomatira zosungunuka ndi utomoni wa polyamide monga chigawo chake chachikulu. Imakhala ndi kutentha kwa madigiri 140-150 ndipo imagwiritsidwa ntchito kwambiri popanga nsapato monga kupukutira zikopa, kukanikiza ozizira, ndi kuumba. Kukonzekera kwake kumaphatikizapo kugwiritsa ntchito dimer linoleic acid, sebacic acid, ethylenediamine, ndi hexamethylenediamine monga zopangira, ndi kupanga utomoni wa polyamide kudzera{8}}kutentha kwambiri kwa polycondensation kutetezedwa ndi nayitrogeni. Njirayi imaphatikizapo kutenthetsa mokhazikika, kupsinjika maganizo, ndi kuyesa kwa mtengo wa amine.

Kufewetsa kwa zomatira izi kumatha kusinthidwa ndikusintha chiŵerengero cha zinthu zopangira, kuti zikhale zoyenera kukonzedwa mu kutentha kwa madigiri 140-200. Kuti mukhale wokhazikika-kutentha kwambiri, 1% ya pyrazole{{5}based anti-anti aging agent (monga 1-phenyl-3-pyrazole) nthawi zambiri imawonjezedwa ku zomatira, kuwonetsetsa kuti ikugwira ntchito ngakhale pa madigiri 260 .